Installations de Soudage
Reflow Soldering with Vacuum - Rehm Thermal Systems Vision XP+
- Void rates of less than 2 %
- Tripartite transport:
- Preheating and peak area
- Vacuum module
- Cooling zone
In-line Vapor Phase Soldering - IBL Löttechnik BLC604i
- Thermal Performance: 235°C
- Max. Board Size: 640 x 540 mm
- Double Chamber Batch Soldering
Reflow Soldering Machine- Ersa Hotflow 7/4
- Thermal Performance: 30-45 KW
- Max. Board Width: 500 mm
Wave Soldering Machine- Kirsten K5360
- Lead-free Soldering
- Max. Board Size: 350 x 440 mm
Selektivlötanlage - Ebso SPA 300 NC
- RoHS
- Soldering area 300 x 300 mm
BGA Rework Station - Martin Expert
- Semi-automatic System
- Max. Hot Gas Soldering Tool
- Hybrid-lower heater with IR and convection
News
22.06.2018 -
PRO DESIGN announces collaboration with Exostiv Labs as new Partner for its proFPGA Product Family
20.06.2018 -
PRO DESIGN announces collaboration with Missing Link Electronics to offer FPGA turnkey solutions
25.08.2017 -
