High-Tech Machinery for the Highest Electronics Standards

Two state-of-the-art SMT lines, precise SPI inspection, and smart manufacturing – ready for your innovation

With the construction of a new production hall in 2018, PRO DESIGN laid the foundation for high-tech manufacturing and invested €2.5 million in cutting-edge SMT and reflow technologies. The next major step followed in 2025: an additional €1.5 million was invested in a fully automated ASMPT line to take capacity and quality to the next level.

An overview of our technologies:

Our Production at a Glance

High-Resolution SPI for Solder Paste Inspection
Inline AOI and X-ray Inspection (3D/X-Ray)
Full Traceability
Process Data Monitoring & MES Integration
Series Production of PCBs from 140 × 80 mm to 600 × 500 mm, with thicknesses ranging from 0.5 to 6 mm
Larger PCB formats are also possible for prototypes – feel free to contact us for individual solutions!

Maschine	Funktion	Details
6 x ASMPT SIPLACE SX	SMT Assembly	Modular high-speed placement systems with interchangeable placement heads, suitable for 01005 components, offering maximum flexibility.
DEK TQL Stencil Printer	Solder Paste Printing	Fully automatic high-precision printer with closed-loop SPI integration, printing accuracy <20 µm, suitable for 01005 components.
DEK NeoHorizon Stencil Printer	Solder Paste Printing	Precise, fully automatic stencil printer with integrated camera alignment, fast cycle times, ideal for high-density SMT layouts.
5D-SPI-System Process Lens	Solder Paste Inspection	High-resolution inline SPI with 5D analysis (volume, area, height, offset, shape), closed-loop functionality, real-time feedback for precise print quality.
2 x Schneider & Koch 3D-AOI	Optical Inspection	3D AOI systems for automatic inspection of components and solder joints, high detection accuracy, ideal for complex SMT assemblies.
Nordson Quadra 3	X-ray Inspection	High-resolution 2D/3D X-ray system for non-destructive inspection of BGAs, QFNs, and hidden solder joints, with up to 0.1 µm resolution.
Rehm VisionXP+	Vacuum Reflow Oven	Convection reflow oven with integrated vacuum option to minimize voids, precise temperature profiling, process gas purification, and heat recovery.
ZEVAC ONYX 29	Rework	Fully automatic rework system for complex SMD and BGA components, featuring precise axis guidance, hot gas, and bottom heating technologies – ideal for series repairs and high-reliability applications.
Martin Expert Rework Station	Rework	High-precision rework station for desoldering, placing, and soldering SMD components, including hot gas and infrared technologies – ideal for FPGA, BGA, and µBGA repairs and prototype work.