EMS

Electronics assembly and manufacturing from a single source

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Across approximately 2,000 m² of production space, we manufacture electronic assemblies (PCB assembly), devices, and ready-to-sell end products בדיוק according to your specifications and in compliance with IPC-A-610D standards. Our qualified processes and production workflows are designed for fast, high-quality prototype manufacturing, demanding small series, and premium medium-volume production.

 

Short setup times combined with our flexible working time models ensure maximum manufacturing flexibility. This enables us to reliably meet fixed deadlines and respond quickly to changes. Our certified, clearly structured production processes—together with our strong focus on innovation—ensure short response times, cost efficiency, and outstanding quality down to the last detail.

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SMD - Asssembly

In 2025, the existing Europlacer line was replaced by a second SIPLACE line, resulting in two identical systems now in operation. PRO DESIGN had already invested in a new production facility and state-of-the-art SMD equipment in 2018, including a new solder paste printer, three new placement machines from ASM Assembly Systems GmbH & Co. KG, and two new vacuum reflow soldering systems from Rehm Thermal Systems GmbH.

2

THT-Assembly

At PRO DESIGN, this soldering process can be performed both automatically and manually. Advanced selective, wave, and vapor phase soldering systems ensure efficient and reliable results.

3

Mechatronics

In addition to manual and SMD assembly, PRO DESIGN provides product-specific, cost-efficient assembly of modules and complete devices.

4

Test Facility Services

  • Test Concept Development and Equipment
  • Functional testing of all assemblies and devices
  • In-circuit and burn-in testing
  • EMC testing
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PRO DESIGN focuses on

  • Prototype and medium-volume production
  • Assembly of ultra-miniature components from size 01005
  • Press-fit technology and bonding
  • BGA, μBGA, and FPGA assembly and rework
  • Cable assembly
  • Procurement, warehousing, and inventory management concepts
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1

Commissioning & Installation

  • Support with initial installation and commissioning
  • On-site or in-house training and support
  • Fast identification and prevention of application errors
2

Redesign & Further Development

  • Product optimization and technical advancement
  • Redesign of existing systems – independent of the original manufacturer
  • Adaptation to new requirements, technologies, or markets
3

Failure Analysis & Repair Services

  • Systematic analysis of functional faults
  • Repair and refurbishment of electronic assemblies
  • Transparent updates on the current processing status

Quality Team Services & Equipment

  • Multiple quality inspections throughout the production process
  • Optical inspection at five stations
  • AOI (Automated Optical Inspection)
  • X-ray inspection including BGA analysis
  • Documentation and traceability

Our Machinery

Smd linie neu
MachineryFunctionDetails
6 x ASMPT SIPLACE SX SMT-AssemblyModular high-speed placement systems with interchangeable heads, designed for 01005 components and delivering maximum flexibility.
DEK TQL SchablonendruckerSolder Paste PrinterFully automated high-precision printer with closed-loop SPI integration, printing accuracy <20 µm, suitable for 01005 components
DEK NeoHorizon SchablonendruckerSolder Paste PrinterPrecision fully automated stencil printer with integrated camera alignment, fast cycle times, ideal for high-density SMT layouts
5D-SPI-System Process LensSolder Paste Inspection Systemigh-resolution inline SPI with 5D analysis (volume, area, height, offset, shape), closed-loop functionality, real-time feedback for precise print quality
2 x Schneider & Koch 3D-AOIOptical Inspection3D AOI system for automatic inspection of components and solder joints, high detection accuracy, ideal for complex SMT assemblies
Nordson Quadra 3X-Ray InspectionHigh-resolution 2D/3D X-ray system for non-destructive inspection of BGAs, QFNs, and hidden solder joints, with resolutions down to 0.1 µm
2 x Rehm VisionXP+ Vacuum Reflow OvenConvection reflow oven with integrated vacuum option to minimize voids, precise temperature profile control, process gas cleaning, and heat recovery
ZEVAC ONYX 29ReworkFully automated rework system for complex SMD and BGA components, featuring precise axis control, hot gas and bottom heating technology, ideal for series repairs and high-reliability applications
Martin Expert ReworkstationReworkHigh-precision rework station for desoldering, placement, and soldering of SMD components, including hot air and infrared technology, ideal for FPGA, BGA, and µBGA repairs as well as prototype processing